Hot melt Moulding

For small and medium quantities in the cable and connections field, Lacon has been providing hot melt moulding for two years now, which we can use to cater for your customers' requirements very flexibly.
The process is much more cost effective, compared with cost-intensive conventional moulding. It works in the low-pressure area, which enables the use of cost-saving and quick to make aluminium moulds. Low processing pressure and low temperature also allow it to be applied directly on sensitive units such as printed circuit boards or coil units, which is not always possible with standard moulding processes.

Options with the hot melt procedure:

  • Extrusion coating of components into shape (plugs)
  • Cable strain relief by extrusion coating of the cable on the plug
  • Integration of electronics in cables
  • Logos and markings on the moulded part
  • Manageable costs, even with small quantities
  • Materials that can be exactly matched to the application
  • Individual sleeves for cables
  • Special anti-kink cable sleeve

Furthermore, it is possible to vary the softening point, application temperature, bond to the support material, viscosity, Shore A hardness, elongation and combustion behaviour according to the requirement profile.

The hot melt chips used by Lacon are based on renewable raw materials that are also solvent-free and environmentally friendly.