Lacon encapsulates using the process adapted to customer requirements and materials from 1–2 component epoxy resin through to various types of polyurethane. The polyurethanes used have a low-volume shrinkage and dissipate the heat generated from the switching operations. They exhibit a favourable reaction to temperature change. Furthermore, it is possible to adjust their density and hardness as required. This makes it possible to produce enclosures of very different consistency – from solid to cellular and from hard to soft.

Mould encasing technologies protect printed boards and circuits from external influences such as:

• Dampness (e.g. condensation)
• Unwanted access
• Recognition