In terms of circuit diagram input and printed board design, Lacon Engineering offers you expertise from years of project experience at various degrees of complexity. Our range goes from single and two-layer printed circuits up to multi-layer boards assembled on both sides with ten or more layers, as well as flexible printed boards and layouts suitable for bonding.
Decades of working with printed circuit board producers in Germany and Switzerland ensures that we benefit from long-term technology transfer, which is essential these days.

To ensure that all functions meet the EMC directives and standards, it goes without saying that the electrical components are professionally laid out and constructed right from the design process. The expertise of our layout designers is the decisive element here in producing EMC circuits.

Even for small series of an electronic sub-assembly or printed circuit boards, a "Design For Manufacturing (DFM)" can be an equally crucial factor towards considerable cost reductions in the manufacturing process. Intensive collaboration with our in-house electronics production department also provides the best results for you in this case.