BGA rework

Placement errors with BGA components? Scrap the module? – not with us.

We are happy to help you correct placement errors with our BGA Rework Service. Desoldered components are reballed and replaced on the circuit board.

Since we use only professional BGA rework equipment, we can guarantee the damage-free removal and replacement of your precious BGAs!

Our strengths – your benefits

  • SMD component repair/exchange
  • Heating, hot gas (nitrogen with IR support)
  • Components to 01005, QFP, PLCC, BGA to μBGA and CSP, no flip chips
  • BGA reballing
  • Circuit board repair service

Technical equipment

Martin Rework Expert 10.6 Station

High-performance unit for large multilayer boards or batch PCBS with medium- to very large-sized components.

  • 10,000 W thermal output in hybrid technology
  • 500 x 650 mm² Heating plate
  • Advanced Vision Placement (AVP) for automated component alignment
  • DBL 06 control unit with six high-resolution thermocouple (type K) inputs

Technical data with the kind permission of Martin-SMT GmbH.