In industrial and power electronics, 95% of all modules use mixed-mode assembly. We integrate HEEB laser-guided assembly tables into partial linear production.
Part preparation – involving the bending, cutting, beading and programming of all types of IC components – is completed directly within the unit.
A transponder system ensures that modules can be identified at any time and at any point within the production process.
- Regular personnel training
- Certified solder personnel
- Solder mixed-mode assembly in one work step
- Transponder system for linear assembly
- Defence systems (leaded solutions)
- Minimisation of setup and one-off costs
- Custom jig construction
SEHO MWS2340
- PLUS 5-hole Wörthmann wave soldering unit
- Modular construction, easily expandable
- Pure nitrogen atmosphere
- Spray fluxer with HVLP technology (precisely-defined spray pattern, substantial reductions to flux consumption)
- Homogeneous warming of modules
- Variable preheat range in various lengths, with IR, quartz or convection units plus integrated cooling zone
- Sector-based soldering using custom solder frames
- Process gas cleaning and extraction
- Solder parameters stored to ensure process reliability
- Monthly machine capability assessment (MCA) + tin analysis by indep. lab
- Working materials
- Tin SN 100 C (Sn 99.3/Ni 0.7), melting point 221 °C
- Alcohol-based no clean flux
Hakko solder baths
- Specialised solder nozzle inserts for all requirements
- Various temperature settings possible, 300–450 °C
- Selective flux application
- Post-solder PCB cleaning
- Capacities for highly specialised repair work
- Working materials
- Tin SN 100 C (Sn 99.3/Ni 0.7), melting point 221 °C
- Alcohol-based no clean flux
- PCB preheating to avoid component temperature stress