Hotmelt moulding

Hotmelt injection moulding technology for small and medium-sized cabling and connector batches:

  • Significantly more cost-effective than other injection moulding options
  • Low-pressure technology
  • Aluminium moulds
  • Direct application, even to sensitive components (boards, inductors, etc.)

The specifications can also be varied in terms of the softening point, operating temperature, bonding to the carrier material, viscosity, Shore A hardness, elongation after fracture and burning behaviour.

The hotmelt granulates we use are based on renewable raw materials that are solvent-free and can be worked using environmentally-friendly processes.

Typical applications for hotmelt moulding:

  • Injection encapsulation of components (connectors)
  • Strain relief by encapsulating the cable as it exits the connector
  • Integration of electronics into cabling
  • Logos and markings on the injection-moulded part
  • Moderate costs, even for smaller batches
  • Custom cable grommets
  • Specialised cable kink protection
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