Modern electronics would be unthinkable without printed circuit boards: As the backbone of electronic devices, PCBs ensure the successful integration of many components such as capacitors, resistors and power supply connections. PCBs make many things possible - if the quality is right. And this is exactly what we at Lacon Electronic have been emphasising for over 40 years.  

Our PCBs are highly customised and flexibly manufactured - in quantities from 10 to 1 million. As a competent EMS partner, we look forward to supporting you personally with your next project: with top advice, customised service and the tried-and-tested Lacon product quality.

Schnittstellen-Kühlkörper

Our services at a glance

SMT assembly
Components up to 01005, fine pitch, complex multilayers, flexstrip, aluminium PCBs for LEDs, micro BGAs (QFP 55x55) and much more.
Wire assembly THT
HEEB laser guide tables, soldering process on SEHO MWS 2340
Mixed assembly
Bending, cutting, beading and programming of IC components; 95% of all assemblies are mixed assemblies.
Flexible production from 10 to 1,000,000 units
Special feature: Blank size up to 550 x 400 mm possible!
Obsolescence & Life-Cycle Management
Discontinuations, last-time-buy, welding
Samples & prototypes
100% quality in every piece

Surface mounting technology (SMT)

for a successful project

Bigger, faster, further - the demand for assembled PCBs is constantly increasing. That's why we at Lacon Electronic equip modern PCBs with surface-mounted components (SMD). And thanks to our partially or fully automated assembly lines, we guarantee our customers an optimised high-mix / low-mid volume service portfolio. Because what counts in the end is that you are satisfied and realise a successful project with us.

Printed circuit boards from Lacon - manufactured in Europe, globally competitive

Is surface mounting (SMT) worthwhile in Asia? We at Lacon Electronic answer this question with genuine manufacturer quality "Made in Germany" - at absolutely competitive prices, by the way. In general, manufacturers of complex electronics carefully weigh up long transport routes and costs as well as possible delivery delays.

With our concept of off-line upgrading of feeder benches, we enable short, fast routes with high productivity in the SMT sector - with international sourcing and, above all, without the risks of outsourcing production to the Far East.

Our traceability concept: transparency throughout the entire production process

Our fully automatic machines achieve a resilient average of 35,000 components per hour - with excellent quality. Thanks to our in-house developed traceability concept, we ensure the best possible traceability of the raw material: during the entire production process of the assemblies right down to the component level ("trace up" and "trace down").

Our traceability concept

  • Linking the batch number of the raw material with the serial number of the manufactured assembly and the customer-specific delivery note
  • Seamless data tracking using a machine & storage system
  • Registration: barcode via label

Your added value

  • Clear traceability of complaints or "field returns" for error analysis
  • Reduction in processing time for complaints
  • Quality defects and material damage can be traced back to the manufacturer
  • 35,000 components per hour while guaranteeing the highest quality

We offer traceability at assembly level as standard - traceability at component level can also be guaranteed under the appropriate conditions.

Our SMT machinery makes it possible

We operate 3 lines plus stand-alone machines: for prototyping, the production of small series and sample construction.

Surface mounting machines

3 x Samsung SM421

  • 6 spindles with flying CCD vision or stage vision (with megapixel camera)
  • Polygon vision for automatic special component recognition
  • 120 feeder positions max. (8 mm), SM non-stop feeder (can be changed during operation), intelligent feeder system, feeder stock control
  • Traceability
  • Automatic pick-up correction
  • Component spectrum Flying Vision: 01005 ~ 22 mm IC, QFP ~ 0.3 mm (lead pitch), CSP/BGA ~ 0.5 mm (ball pitch)
  • Stage Vision: ~ 55 mm, connector ~ 75 mm
  • Placement speed 21,000 CPH (chip BT/h) (IPC9850)
  • Placement accuracy ±50 μm chip, ±30 μm QFP
  • Board size min. 50 x 40 mm, max. 600 x 400 mm (L-type)
  • Board thickness 0.38 ~ 4.2 mm

1x Samsung SM 482

  • 6 spindles with Flying Vision or Stage Vision
  • Placement speed: 27,000 CPH
  • Board thickness: 0.38 - 4.2

1x SM 485

  • with Stage Vision or Flying Vision
  • 4+1 spindles
  • Component speed: 22,000 CPH
  • max. board size: 740 x 460 mm

Solder paste printer

EKRA X3 Sreen Printer

  • EKRA Vision Alignment System (Look up + Look down)
  • optional automatic 2D-Inspection (post print inspection)
  • programmable, automatic stencil cleaning
  • maximum print area: (X) 440 x (Y) 310 mm
  • Screen frame size maximum: 620 x 480 mm

Samsung SMP200XL

  • optional automatic 2D-Inspektion
  • programmable, automatic stencil cleaning
  • Screen frame size maximum: 736 x 736 mm
  • applicable PCB size maximum 650 x 400 mm

EKRA Serio 4000 Volume

  • CloseLoop function
  • Paste height control
  • iQUESS quick squeegee change system
  • Stencil underside cleaning
  • EKRA Vision Alignment System
  • Simple and convenient condition thanks to SIMPLEX user interface

Wire assembly (THT)

the manual assembly technique of your choice

Through-hole technology is the manual assembly technique of choice for wired components. Even today, it is still primarily used for assembling PCBs with different components that are exposed to high loads - in addition to connectors and relays, these include power coils and semiconductors or electrolytic capacitors.

Mixed assembly

SMT meets THT

95% of all assemblies in industrial and power electronics are mixed assemblies. This means that both SMT and THT are used for assembly. For this purpose, Lacon Electronic has integrated HEEB laser light spot tables into the part line production. The components are prepared directly in the department: Bending, cutting, beading and programming of IC components of all kinds. A transponder system ensures that assemblies can be identified at any time and at any point in production.

Your advantages of THT and mixed assembly

  • Continuous staff training
  • Certified soldering personnel
  • Mixed assembly soldering in one operation
  • Transponder system line assembly
  • Military technology (leaded solutions)
  • Minimisation of set-up and one-off costs
  • Customised fixture construction
  • Prototyping and sample production

Our machinery for your wire assembly

We operate a wide range of assembly machines so that we can guarantee a smooth process and maximum efficiency for our customers. Because your success is our goal.

Seho MWS2340

  • PLUS 5-hole Wörthmann shaft
  • modular design, quick to expand
  • Pure nitrogen atmosphere
  • Spray fluxer with HVLP technology (clearly defined spray pattern, significant reduction in flux consumption)
  • Homogeneous heating of the assemblies
  • variable preheating area of different lengths, with IR, quartz or convection modules plus integrated cooling zone
  • sectorised soldering with individual soldering cover frames
  • Process gas cleaning and extraction
  • Process reliability thanks to stored soldering parameters
  • Monthly machine capability test (MFU) + tin analysis by independent laboratory
  • Working materials: tin SN 100 C (Sn99.3 / Ni 0.7), melting point 221°C; alcohol-based flux, NoClean

Laserlite HEEB placement tables

  • Semi-automatic placement using programmed lasers
  • Short set-up times
  • Process reliability with high placement density and number of components

Hakko solder baths

  • Special solder nozzle attachments for all requirements
  • various temperature settings possible: 300 to 450°C
  • selective flux application
  • subsequent PCB cleaning
  • Capacities for highly specialised repair work
  • working material: tin SN 100 C (Sn99.3 / Ni 0.7), melting point 221°C; flux alcohol-based, NoClean; preheating to avoid component temperature stress

Prototype and customised production

Customised special assemblies

We love hand-assembled printed circuit boards! Do you too? We sit down at the workbench for many essential components: prototypes, development samples, complicated components and old assemblies that are required in small quantities. Because we are constantly working to provide you with exactly the PCBs that will drive your project and your business forward in the long term.

Our speciality area for prototyping

In our prototype and sample production area, your wishes are fulfilled within a few days: Here we produce your PCBs in single or small quantities - always true to detail according to your specifications.

  • Autonomous specialised area, detached from series production
  • highly flexible
  • Fast production
  • Customised products made to measure

Quality assurance

in the area of production testing and inspection

Play in the top league with us: Our testing systems are well-known and popular throughout Europe - we have set new standards in the field of production testing and inspection. And so that we can guarantee our usual high Lacon quality in the long term, we have developed a rigid control system.

Zero-defect strategy for quality control

We can dispense with random samples, as every item we manufacture is carefully checked and tested. During our inspections, we check the completeness of all components such as electrolytic capacitors, connectors, sockets and IC polarity. We carry out solder joint check-ups on unsoldered components and protruding elements (tombstone effect). Throughout the entire process, traceability at component level is particularly important to us.

Maximum security

Our electronics purchasing department organises specific components worldwide and works closely with test houses in the case of discontinued components or uncertain sources of supply. In this way, we can permanently ensure the authenticity of all components.

Special tests? No problem.

If the relevant conditions are met, we can also offer you traceability at component level. Please feel free to send us an enquiry - we are always available to advise you with our specialist knowledge.

Our test device: AOI system TR7500QE

As an algorithm-based system, the TR7500QE AOI system from TRI Innovation measures precise physical and optical features of assemblies - in contrast to an image-based system. This minimises the occurrence of false calls (erroneously reported defects). This is because components are checked using clear target data and not simply by comparing component images (manually selected good samples).

The TR7500QE AOI system offers you

  • 3D high-performance inspection of solder paste and assemblies through pioneering combination of 2D + 3D
  • Adaptive digital 4-way fringe pattern projection
  • 3D height range up to 20 mm
  • high-speed image acquisition with CoaXPress
  • customised templates for zero defect slippage on all assemblies
Maschine in der Elektronik-Industrie
Production
Individuality in every respect
 
Zahnräder
Mechatronics
Electromechanics
 
Bedienpanel mit Schnittstellen
Device & system construction
Top EMS providers and ODM
 
Schaltschrank
Switch cabinet construction
From the 3D model to series production
 
Lackkontrolle unter UV-Licht
Protection procedure
safe all round
 
Bunte, verdrillte Kabellitzen.
Cable assembly
Over 30 years of expertise
 

Questions about PCB assembly

SMT stands for surface mounting technology and describes surface mounting technology for the partially or fully automated assembly of printed circuit boards. In this process, automatic placement machines suck in components that will later be mounted on the PCB and place them on the carrier material.

Through-hole technology involves manual wire assembly of printed circuit boards. In this process, wires with mounted components are cut to the required length. These wire ends of the components are then inserted into the contact holes of the PCB and soldered firmly.

The assembly of printed circuit boards with a combination of SMT and THT is called mixed assembly - this is currently the most common method for the assembly of components.

SMD stands for Surface-Mounted-Device, while SMT is called Surface-Mounting-Technology. In concrete terms, this means that SMT is the technology of surface mounting and SMD is a surface-mounted component.

PCBs - also known as printed circuit boards - can be assembled using various methods. The most common are SMT, THT and mixed assembly. In general, assembly processes of electrical components on a printed circuit board are referred to as mounting - always for use in complex electronic devices.

As the name Electronics Manufacturing Services suggests, EMS service providers plan and manufacture specific electronics. The speciality: These electronics experts not only manufacture electronic components, but also organise all steps from development to production and delivery of the final product.

AEO
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CCC
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Contact

Lacon Electronic GmbH

Hertzstraße 2
85757 Karlsfeld
Deutschland
T: +49 8131 591-0
F: +49 8131 591-111
E: info@lacon.de